This report explains how those changes are shifting demand for key components—HBM, GPUs/accelerators, DDR5, advanced substrates, high-speed optics, and power systems. It also outlines supply risks, regional differences, and what buyers should prioritize as AI infrastructure spending grows through 2030.
Discover why CoWoS packaging, HBM supply, and 3nm wafer capacity are falling short of AI demand through 2027, and what this means for procurement leaders.
AI demand isn’t a bubble. Learn how foundry capacity splits and structural memory constraints are reshaping semiconductor supply and procurement strategy.
Semiconductor analyst Claus Aasholm joins Fusion Worldwide’s Market Research Manager, Andrew Czuczwa, to unpack the global memory squeeze—covering DRAM, HBM, and foundry capacity—and share what buyers need to know as AI infrastructure reshapes supply, pricing, and investment cycles.
AI and automotive demand are reshaping GPU sourcing. Learn how market shifts beyond gaming are tightening supply and redefining procurement strategies.
China’s export rules on rare earth metals are tightening HDD supply and raising costs. Fusion Worldwide helps teams secure reliable sourcing and reduce risk.
Global export restrictions have frozen Nexperia’s supply chain. Learn how U.S., China, and Dutch policies are reshaping semiconductor sourcing in 2025.