NEWS + INSIGHTS

Automotive OEMs face growing memory risk in 2026 as AI demand tightens DRAM supply, limits visibility, and raises costs across EV and ADAS platforms.

Visit Fusion Worldwide at NEPCON Tokyo 2026 to explore its new Agentic AI Intelligence Report on hybrid infrastructure and resilient electronics supply chains.

As AI shifts from generative to agentic systems, infrastructure requirements change—reshaping demand for HBM, DDR5, edge compute, and hybrid AI environments.

Why passive components are emerging as a 2026 supply risk. Learn how server and GPU demand, flat capacity, and rising costs are reshaping passive availability.

The December Greensheet provides market intelligence on electronic components, analyzing AI-driven demand, memory and storage constraints, pricing trends, lead times, and global supply chain shifts.

This report explains how those changes are shifting demand for key components—HBM, GPUs/accelerators, DDR5, advanced substrates, high-speed optics, and power systems. It also outlines supply risks, regional differences, and what buyers should prioritize as AI infrastructure spending grows through 2030.

Discover why CoWoS packaging, HBM supply, and 3nm wafer capacity are falling short of AI demand through 2027, and what this means for procurement leaders.

The latest Greensheet breaks down critical component shortages and price moves impacting global procurement: Nexperia substitution chaos, Samsung’s DDR5 price surge, Intel’s 10nm portfolio wind-down, enterprise SSD allocation to Big 7 cloud buyers, tightening RDIMM and AI-server components, and shifting GPU availability. Essential insights for sourcing leaders navigating 2025’s volatile semiconductor market.

AI demand isn’t a bubble. Learn how foundry capacity splits and structural memory constraints are reshaping semiconductor supply and procurement strategy.

Semiconductor analyst Claus Aasholm breaks down the structural forces behind today’s memory squeeze and what it means for DDR4, DDR5, and HBM supply.