Key Themes
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DDR4 Shortages Push Pricing Higher: Spot prices have jumped 10% with lead times now stretching into 2026. Buyers are shifting to DDR5, where RDIMM and DIMM pricing is also climbing 20–35%.
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AI Demand Tightens CPU and GPU Supply: Supply for A100, H100, and Blackwell GPUs remains limited. AMD Turin and Intel Sapphire Rapids server CPUs are in high demand, while mobile CPU supply stays tight.
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Storage and Networking Delays Widen: Geopolitical disruptions have impacted Mellanox NIC lead times. SSD prices are rising 5–8%, and 16TB HDDs are increasingly constrained as manufacturers prioritize higher-capacity models.
Product Updates
Market Dynamics and Shifting Supply
- A fire incident occurred at ATX, an assembly facility in Weihai, China. The factory supports several major IC manufacturers, including Toshiba and Texas Instruments. A slight price fluctuation has been observed in the open market for Toshiba products, particularly MOSFETs.
Pricing Shifts and Allocation Challenges
Strategic Allocation and Market Volatility
- High-end data center GPUs are experiencing a demand surge.
- A100 80GB supply is depleted.
- H100 80GB and 94GB models are at End-of-Life (EOL) with limited availability. The H100 94GB has a lead time of 4–6 weeks.
- Quality concerns and increased trading activity persist around the EOL A100 80GB.
- Nvidia Blackwell 4000/5000 series is seeing longer-than-expected lead times, with general availability expected in August or later.
Finished Goods
Jetson Series in Demand
- Various Jetson series shipments may be delayed until year-end due to sustained demand.
- Several customers have reported quality issues with the NVIDIA Jetson Orin NX 8GB/16GB, tied to voltage-related problems.
Persistent Shortages and EOL Notices
- Mellanox CX7 series NIC cards are facing delivery delays, which have been worsened by raw material shortages resulting from the Iran-Israel conflict. Lead times have now shifted from September to November 2025.
Bottlenecks and Migration to DDR5
- The DDR4 market remains extremely tight. Lead times are extending into early 2026, and spot pricing is up another 10%.
- The DDR4 shortage is accelerating the migration to DDR5, which remains more stable, with pricing increases of 1–7% depending on density.
- Samsung is not expected to release significant inventory in Q3, and LPDDR4/4X supply will be highly constrained due to EOL status and sustained demand.
- Hynix is expected to adjust pricing between July 15–25. Availability remains limited.
Demand Realignment and Pricing Pressure
- Samsung RDIMM direct pricing is expected to rise by 20–30%.
- Kingston has increased the pricing of DDR4 desktop DIMMs by 35%.
- DDR4 RDIMM demand remains high amid tight supply. Prices for 16 GB, 32 GB, and 64 GB modules continue to rise.
- Demand for UDIMMs is increasing in the gaming segment, while demand for standard desktops remains stable.
SSD
Supply Constraints and Price Increases
- Supply of low-capacity enterprise SSDs remains constrained.
- SSD manufacturers have raised quarterly pricing by 5–8% across various densities.
Capacity Shifts and Lead Time Increases
- The shift to 18TB+ HDDs for AI and cloud use is creating shortages in 16TB and smaller capacities.
- Lead times for 2–8TB models now exceed 20 weeks.
- Western Digital confirms that all high-capacity HDDs (20–26TB) are highly constrained, with prices increasing by 10% over the past month.
Extended Lead Times and Allocation
Supply Chain Trends
- Generative AI & Chip Customization: The AI boom is accelerating demand for performance-optimized chips, leading to increased investment in ASICs, domain-specific GPUs, and in-house design from OEMs and telecoms.
- Smart Manufacturing Adoption: Industry 4.0 tools, such as AI-driven predictive maintenance and digital twins, are transforming wafer fabs into data-centric environments.
- Semiconductor Sovereignty & Reshoring: Global reshoring and government-backed semiconductor initiatives are reshaping the supply chain around sustainability and zero-defect production.
- Innovation Beyond Moore's Law: Advances now focus on materials science and heterogeneous integration—3D packaging, chiplets, SiC/GaN adoption, and emerging quantum and neuromorphic technologies.
Manufacturer News & Updates
- Intel: Undergoing a major restructuring, Intel is laying off 15–20% of its Intel Foundry workforce—potentially over 10,000 jobs—driven by performance reviews, cost-cutting, and strategy shifts. CEO Lip-Bu Tan acknowledged Intel is no longer among the top 10 semiconductor firms. TOI Article
- NVIDIA: CEO Jensen Huang promoted AI in D.C. and Beijing, confirming that NVIDIA is submitting applications to resume H20 GPU sales in China and launching a fully compliant RTX PRO GPU for digital twin applications. NVIDIA Blog
- SK Hynix: Now integrating Infinitesima's AFM metrology for HBM4E stacking, enabling high yields with 16-layer hybrid bonding. Hynix showcased 12-layer HBM4 and HBM3E solutions at COMPUTEX Taipei 2025. Bits & Chips Article
- Infineon: Advancing GaN manufacturing on 300mm wafers with first samples expected in Q4 2025—reinforcing its IDM leadership in the GaN space. Infineon Press Release
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