The Greensheet | August 2026
Key Takeaways
The "Great Passive Shortage" Officially Begins: MLCC and tantalum capacitor markets have entered a severe shortage phase, driven by AI server demand (high-capacitance MLCCs) and automotive requirements. Major manufacturers are implementing 15–30% price increases, restricting broker sales, and extending lead times to 20–50+ weeks. Raw material constraints, including PCB resin disruptions and rare earth export bans, are compounding the crisis.
Memory & Storage Allocation Collapses for Non-Hyperscalers: DDR5 RDIMM (64GB/128GB) and high-capacity enterprise SSDs (15TB–122TB) remain strictly allocated to hyperscalers, with fulfillment rates for traditional OEMs dropping below 30%. Legacy memory (DDR3, low-density eMMC, and NOR Flash) is facing aggressive EOL notices from Micron, Kioxia, and SanDisk, forcing frantic last-time buys and costly redesigns.
Texas Instruments & Analog Devices Trigger Cascading IC Price Hikes: TI and ADI are enforcing massive portfolio-wide price increases (15–85% on specific AI and automotive PMICs/signal chains) with lead times stretching past 40–50 weeks. Decommitments are becoming routine, forcing Tier 1 automotive and industrial CMs to aggressively source from the open market to avoid line-down situations.
NVIDIA Blackwell & Enterprise GPU Pricing Shocks the Market: NVIDIA has implemented aggressive price hikes (20–66%) across its Blackwell workstation and server GPU lineup (RTX PRO 6000, 5000, 4000 series). Meanwhile, H200 GPUs face sudden lead-time extensions (40–48 weeks) as the model approaches EOL, while export monitoring tightens globally.
Product Updates
Integrated Circuits (ICs)
Price Hikes and Raw Material Bottlenecks
- Texas Instruments is enforcing a new round of price increases effective October 1, with AI server PMICs (TPS, UCC series) and high-speed signal chains seeing 15–85% hikes. Lead times remain highly unstable, frequently exceeding 20–48 weeks, with MicroSiP power modules (-SILR suffix) facing extreme allocation gaps.
- Analog Devices (ADI) will implement another round of price adjustments effective September 13. Lead times for precision op-amp MPNs are pushing 400+ days (e.g., AD5545BRUZ at 476 days), severely impacting industrial NPIs.
- STMicroelectronics lead times have extended to 40–50 weeks, particularly for the STM32 MCU series and sensors. ST is prioritizing high-margin AI and automotive products, leaving industrial and consumer allocations severely constrained.
- Infineon supply constraints are expected to persist through 2027. Automotive-grade power devices and MCUs (e.g., SAK-TC277TP) are seeing 52+ week lead times, with distributors reporting unreliable pricing and delivery confirmations.
- Renesas continues to face fallout from the Kumamoto earthquake. Photocoupler production remains suspended or slowly recovering, and automotive MCUs (RL78, RH850) face severe backlog extensions.
- Microchip implemented a 15–20% price increase across all series effective mid-August, with PIC and MCP series lead times stretching to 20–30 weeks.
- Xilinx/Altera FPGAs (XC7 series and Max 10) remain the most constrained components for networking and industrial customers, with lead times pushing 52+ weeks and substrate limitations forcing 4-month pushouts.
CPUs
Structural Shortages and Foundry Shifts
- Intel Server (Xeon) allocations for Granite Rapids and Sapphire Rapids remain critically tight. High-core-count SKUs (e.g., 6767P) are seeing zero allocation for standard channel partners, with Intel prioritizing hyperscaler AI builds. Older 3rd Gen Xeon processors are receiving accelerated EOL notices.
- Intel Desktop & Embedded small-core CPUs (Alder Lake-N, J6413) remain constrained, though some Q4 relief is anticipated. Embedded 10nm parts continue to face decommits and 52+ week lead times.
- AMD Server (EPYC) Genoa and Turin series remain tightly allocated, with lead times extending as cloud providers absorb output. Sampling for the 6th Gen EPYC "Venice" (up to 256 cores) has begun for Tier 1 customers.
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Browse CPUs
GPUs
Allocation Pull-Backs and Channel Disruptions
- NVIDIA Blackwell workstation and server GPUs are facing massive 20–66% price increases across the RTX PRO 6000, 5000, 4000, and 2000 series. Book costs for the PRO 6000 Server Edition have surged past $14,000, with lead times extending well into Q2 2027.
- NVIDIA H200 lead times have suddenly stretched from 28 weeks to 40–48 weeks as the model faces phase-out/EOL status, creating a scramble for remaining OEM and clean-pull stock.
- Consumer GPUs (RTX 5090/5080) are seeing 20%+ price hikes and stricter end-user verification policies from NVIDIA to combat grey market diversions.
- NVIDIA Jetson Modules have seen price increases of up to 60%, with export monitoring tightening and older modules (Jetson Nano) facing strict allocation limits and EOL timelines.
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GPUs
Memory
Dynamic Pricing and EOL Waves
- DDR5 RDIMM fulfillment rates for non-hyperscalers remain below 30%. Spot pricing for 64GB modules is routinely exceeding $3,100, while contract prices continue to rise 8–10% MoM. Samsung is strategically shifting manufacturing weight toward 6400MHz over 5600MHz for 2H26.
- Legacy DRAM (DDR3/DDR4) is facing aggressive EOL notices. Micron has issued LTB notices for multiple DDR3 densities, and Nanya is quietly consuming remaining wafer inventory without future production plans.
- eMMC & NOR Flash shortages are critical. Kioxia, SanDisk, and Micron are planning to EOL 4GB–32GB eMMC, forcing automotive and industrial customers into costly 64GB or UFS migrations. Macronix and Micron NOR Flash lead times exceed 40 weeks, with prices surging 20–30%.
- LPDDR4/5 allocations for automotive and mobile remain severely restricted, with Samsung and SK Hynix fulfilling less than 40% of contracted demand.
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Memory
Storage (SSD, HDD, NAND)
Capacity Shortages and Manufacturer Price Moves
- Solidigm Enterprise SSDs are seeing 20–30% Q3/Q4 price hikes. High-capacity drives (15TB, 30TB, 61TB, 122TB) are entirely consumed by hyperscalers, leaving channel partners with zero allocation.
- Seagate, WD, and Toshiba HDDs face severe constraints on 16TB–24TB CMR drives. Lead times are pushing into mid-2027, and manufacturers are raising prices 10–20% while aggressively EOLing low-capacity (1TB–4TB) models.
- Hyperscalers are resisting QLC price premiums, defaulting to TLC or high-capacity HDDs, causing supply chain imbalances and forcing manufacturers to adjust production strategies.
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Storage
Networking
EOL Waves and Switch Delays
- Broadcom networking switches (Tomahawk/Trident) and PCIe Gen5/Gen6 switches face 52+ week lead times due to 3nm/5nm/7nm TSMC capacity limits. Broadcom has eliminated non-binding forecasts, requiring 100% binding orders.
- Mellanox/NVIDIA ConnectX-6/7/8 NICs and 400G/800G transceivers remain constrained (20–30+ weeks), with AI infrastructure demand heavily consuming available capacity.
Passives
The MLCC & Resin Crisis
- MLCCs have officially entered a shortage era. Murata, Samsung Electro-Mechanics, Taiyo Yuden, and Yageo are implementing 15–30% price increases. High-capacitance AI server MLCCs (e.g., 100uF) and automotive grades face 20–50+ week lead times, with distributors restricting broker sales.
- PCB Raw Materials are facing a massive shock. Geopolitical disruptions in the Middle East have severely constrained global high-purity PPE resin supplies, pushing PCB lead times to 20–30 weeks and costs up 40%.
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Passives
Supply Chain Trends
- Samsung Warns Chip Shortages to Last Until 2028: Samsung Electronics just delivered one of the starkest warnings yet about the global semiconductor supply crunch during its Q2 2026 earnings call on July 30,
- 2027 Memory Capacity Reportedly Sold Out: DRAM and high-bandwidth memory (HBM) capacity at the three leading memory suppliers has effectively been fully allocated ahead of schedule.
- Micron Streamlines Distribution: Micron is aggressively consolidating its global distributor network, cutting authorized partners in Asia and the Americas to strictly control allocation and prioritize direct hyperscaler and Tier 1 OEM relationships.
- Geopolitical Chokepoints Emerge: From Middle East resin shortages to Chinese rare earth bans and US export controls on AI chips, prices of niche rare earths jump on fears of renewed Chinese export controls.
Manufacturer News and Updates
- Renesas Kumamoto Earthquake Recovery: Renesas has gradually resumed production at its Kawashiri and Nishiki plants following the late-July earthquake, but full wafer input capacity and photocoupler output are not expected to normalize until late Q3, sustaining market-wide panic buying. [Source: Renesas]
- TSMC Warns of 2027 Price Hikes: TSMC has reportedly informed major cloud and networking customers of an impending 10% across-the-board wafer price increase for 2027, signaling that foundational IC and packaging costs will remain inflationary for the foreseeable future. [Source: CNA]
- Memory Supply Crunch Pushes Long-Term Contracts Beyond: Supply shortage is intensifying, with LTAs rapidly expanding beyond the three major memory manufacturers to include SanDisk, Nanya Technology Corporation, and China's ChangXin Memory Technologies [Source: Digitimes].
- Samsung Warns Chip Shortages to Last Until 2028: Samsung Electronics just delivered one of the starkest warnings yet about the global semiconductor supply crunch during its Q2 2026 earnings call on July 30,
- 2027 Memory Capacity Reportedly Sold Out: DRAM and high-bandwidth memory (HBM) capacity at the three leading memory suppliers has effectively been fully allocated ahead of schedule.
- Micron Streamlines Distribution: Micron is aggressively consolidating its global distributor network, cutting authorized partners in Asia and the Americas to strictly control allocation and prioritize direct hyperscaler and Tier 1 OEM relationships.
- Geopolitical Chokepoints Emerge: From Middle East resin shortages to Chinese rare earth bans and US export controls on AI chips, prices of niche rare earths jump on fears of renewed Chinese export controls.