The Greensheet | April 2026 (Clone)
Key Themes
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Memory Market Enters Correction Phase with Volatile Pricing: Following price spikes in Q1, DDR5 RDIMM spot pricing has exhibited increased volatility in April, with inventory flooding China's markets at discounted rates while official contract prices remain elevated. Samsung and Micron continue allocating <30% to non-hyperscaler customers, but distributor-level inventory releases and OEM buffer stock liquidation are creating temporary pricing gaps. Market participants are expected to maintain a "wait-and-see" posture through mid-April, with renewed upward pressure anticipated once Q2 allocations are finalized.
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Renesas Instability Forces Market-Wide Design Shifts: Renesas has become a major point of disruption across multiple supply chains. OEMs are actively designing out Renesas components at the NPI stage due to inconsistent lead times and lack of shipment visibility. The divestment of its timing business has further reduced confidence, with customers reporting halted or undefined deliveries. Competitors, such as Diodes, are rapidly gaining market share through pin-to-pin replacements and faster response times
- Nexperia Supply Chain Fragmentation Drives Permanent Qualification Shifts: Despite limited resumption of domestic shipments from Nexperia China under yuan-based transactions, global OEMs, particularly automotive Tier 1s, are accelerating qualification as drop-in replacements. Malaysia-based production continues to face reliability challenges with lead times stretching to 30–44 weeks. Authenticity verification protocols are adding 2–4 weeks to procurement cycles for the remaining Nexperia-sourced designs.
- Analog Devices Supply Chain Fractures Under Packaging Bottlenecks & Demand Surge: Surging global demand for ADI components has severely outpaced manufacturing throughput in 2026, triggering widespread allocation gaps and delivery instability across industrial, automotive, and enterprise sectors. Standard lead times have ballooned to 26–40+ weeks, accompanied by portfolio-wide price increases of 20–30% implemented in early February. Delivery commitments accelerated sharply through March and April, with power management and precision analog ICs experiencing the most critical shortages.
Product Updates
Integrated Circuits
Price Hikes and Raw Material Bottlenecks
- Texas Instruments enforces stricter quotation protocols, requiring detailed end-customer data and project plans before releasing pricing. Lead times for booking orders have extended to 180 days, with price hikes of 10–30% now applied to legacy and power IC portfolios.
- Renesas is facing significant supply instability, with customers reporting halted shipments and unclear delivery timelines. The divestment of its timing business has compounded uncertainty, driving widespread design-out activity across OEMs
- Monolithic Power Systems is seeing lead time extensions (26–30+ weeks), with strong demand from industrial and automotive applications, tightening availability.
- Analog Devices implements widespread price increases of 15–30% across power and signal chain portfolios. Lead times have stretched to 26–40 weeks, with specific decommits reported for automotive customers. T-Glass substrate constraints are cited as a primary bottleneck for LT-series op-amps and precision references.
- Nexperia's supply situation remains critical. Lead times for Malaysia/Philippines production have slipped to 30–44 weeks. Automotive customers report inability to secure allocation, with orders placed in late 2025 now pushed to late 2026. Pricing is expected to increase ~10–15% as the company absorbs overflow demand and navigates export control complexities.
- Infineon & On Semi are seeing lead times double to 30–52 weeks as they absorb overflow demand from Nexperia. Infineon has announced price increases effective April 1, while On Semi faces wafer capacity constraints at its Le Shan, China, facility. Automotive Tier 1s report difficulty securing MOSFET and power management IC allocation.
- Diodes Incorporated's lead times have stretched significantly, ranging from 48 weeks to 1 year in some cases. The company is benefiting from Renesas design-outs, seeing increased demand across replacement programs.
CPUs
Structural Shortages and Foundry Shifts
- Intel Server (Xeon) shortages persist for Sapphire Rapids, Emerald Rapids, and Granite Rapids. Intel has confirmed price increases of 12–20% effective March 29, 2026. Lead times for embedded 10nm parts (Elkhart Lake, Raptor Lake-E) are extending into 2027–2028, with some allocations completely decommitted. Customers report partial deliveries improving in April, but fulfillment rates remain below 60%.
- AMD Server (EPYC) remains tightly allocated, with hyperscaler and AI-related demand continuing to absorb the majority of supply. Limited visibility on new orders and extended lead times for high-core-count SKUs. No meaningful easing in supply conditions has been observed.
- Intel Desktop & Embedded small-core CPUs (N-series, J6412/SRKUA) remain critically constrained. Intel is deprioritizing low-margin SKUs to focus on Panther Lake/18A AI PC ramp. Price increases of ~10% are being enforced starting late March, with frequent decommits on N97, N305, and J6412.
GPUs
Allocation Pull-Backs and Channel Disruptions
- NVIDIA Blackwell (RTX 6000 / 5090) server edition is seeing price hikes of 25%. Consumer RTX 5090 supply remains constrained by GDDR7 memory shortages.
- The RTX PRO 6000 Blackwell Server edition is seeing a spike in demand from customers globally. Lead times are averaging 12+ Weeks.
- NVIDIA RTX 4000/5000 Ada lead times remain extended (48–52 weeks), with production being curtailed to focus on Blackwell. Distributors report no firm delivery schedules, and NVIDIA is requiring the return of allocated inventory to fulfill hyperscaler orders.
- NVIDIA Jetson Modules has introduced updated part numbers for T5000 and T4000 modules to address acoustic noise issues. EOL notices for Jetson Nano (900-13448-0020-000) set the final forecast deadline for May 15, 2026, with the last ship date for January 15, 2027.
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All GPUs
Memory
Dynamic Pricing and Allocation Collapse
- A new "post-settlement" model is emerging where final pricing is adjusted based on market rates after delivery, shifting all risk to the buyer. Customers report weekly price resets and NCNR terms becoming standard practice.
- Samsung is proposing 110% MoM increases for DIMMs to OEMs. Hyperscalers are signing LTAs extending to 2030, effectively locking out traditional OEMs and automotive sectors until at least 2027.
- Shortages for DDR3/DDR4 will see continued price increases, with 2027 allocation projected to be worse than 2026.
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All Memory
Storage
Sold Out Through 2028
- Enterprise SSD supply is getting more constrained, with the majority of allocation going to China. Customers are seeking open market available, leading prices in an uptrend. SATA SSDs (Solidigm D3-S4520/S4620) face EOL notices with the last order date of September 30, 2026.
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All Storage
Networking
EOL Waves and Switch Delays
- Mellanox ConnectX-7/8 lead times have extended to 20–24 weeks (up from 2–4 weeks), with ConnectX-8 facing similar constraints. NVIDIA bundles CX8 NICs exclusively with GB-series GPUs, making standalone purchases nearly impossible. H200-related demand is driving a surge in CX7 400G single-port cards.
- Broadcom cards currently stretch to 52-week lead times, with constraints tightening further in 2027 due to insufficient 3/5/7nm capacity. SS24/SS26 series switches face imminent shortages as AI infrastructure demand consumes capacity.
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All Networking
Passives
The T-Glass Bottleneck
- MLCC & Tantalum stretching to 16+ weeks. Tantalum capacitor lead times exceed 40 weeks, and vendors are warning of potential discontinuities for low-margin lines.
- Murata and Panasonic have announced 20–40% price increases effective May 2026.
- Murata's GRM185 series is commonly used in Server, Power Supplies, and Wearables applications. The production is currently only in Japan, and the capacity is insufficient to meet the global demand. Expecting a shortage in the second half of this year.
- T-Glass Substrate constraint is now the primary bottleneck for ADI, Intel, Lattice, and Sony. Glass cloth fabric lead times have extended from 4 weeks to 20 weeks, causing decommits and forcing foundry diversions. Nittobo remains the sole qualified supplier for high-performance CMOS applications.
- Helium shortages stemming from Middle East tensions are impacting PCB testing, capacitor production, and optical component manufacturing. Japanese and Korean manufacturers report activating emergency procurement protocols, with no meaningful capacity relief expected until late 2027.
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All Passives
Supply Chain Trends
- OpenAI has reportedly entered into a multi-year agreement to pay chip startup Cerebras Systems more than US$20 billion for AI server capacity. The deal represents an aggressive move by the ChatGPT creator to diversify its hardware supply chain and mitigate its reliance on Nvidia. [Source: Digitimes]
- YMTC and CXMT are accelerating expansion into 2026. YMTC will begin mass production of advanced NAND at its Wuhan fab in the second half of 2026. Meanwhile, CXMT planned to allocate 7.5 billion yuan (US$1.1 billion) from its planned initial public offering for “technical upgrade for mass production lines of memory wafers” [Source: China Post]
Manufacturer News and Updates
- Kioxia NAND Flash EOL Announcement: Kioxia has officially announced the discontinuation of Floating Gate and BiCS FLASH™ gen.3 products, impacting SLC, MLC, and TLC memory across 32nm, 24nm, and 15nm nodes, including eMMC, UFS, and BGA form factors. Last Time Buy forecast due by September 30, 2026, with Last Time Shipment scheduled through December 31, 2028.
- STMicroelectronics Price Increase Effective April 26: STMicroelectronics has issued an official notification that all product series will have a price increase starting from April 26, 2026. The MCU series will increase by 5%; the sensor series increases, ranging from 15% to 70%, depending on MPN. All unshipped orders with lead-time bookings will be subject to revised pricing.