Don’t Just Source Components, Future-Proof Your Supply Chain. Join Fusion Worldwide at NEPCON Tokyo 2026, Booth E23.

At Fusion Worldwide, we don’t just follow technology, we help shape how it’s deployed, scaled, and sustained in the real world. As a global leader in electronics component supply chain solutions, we enable OEMs and EMS providers to navigate sourcing complexity, mitigate risk, and accelerate innovation especially as AI transforms every layer of the product lifecycle. 

That is why we are excited to announce our participation at NEPCON Tokyo 2026 (Booth E23) the premier global event for electronics manufacturing and smart factory innovation. And this year, we’re bringing more than just components, we’re bringing vision. 

2025 Intelligence Report on Agentic AI: Preparing for the Hybrid Infrastructure Surge. 

At NEPCON, we will be unveiling key insights from our newly published intelligence report: Agentic AI: Preparing for the Hybrid Infrastructure Surge

Why does this matter to the electronics industry? 

Because agentic AI or autonomous systems that reason, act, and collaborate across workflows is already redefining how companies design, source, manufacture, and service electronic products. Early adopters are achieving 10% to 25% EBITDA gains by embedding AI not just as a tool, but as an active agent in their operations. 

Our report reveals: 

• How leading enterprises are moving beyond pilots to embed AI into core workflows 
• The four levels of agentic AI maturity and where electronics manufacturers stand today 
• Why data quality, process redesign, and pragmatic architecture matter more than “perfect” AI models 
• Real-world challenges related to agentic AI such as increased data silos, IP protection, vendor lock-in, and human-in-the-loop oversight.  

And for the first time, we’ll connect these AI transformation principles directly to the electronics supply chain, showing how intelligent agents can optimize component sourcing, predict obsolescence, accelerate NPI cycles, and strengthen supply resilience. 

Meet Marcus Chen, Our Newly Promoted Executive President 

We are honoured to have Marcus Chen, Fusion Worldwide’s newly promoted Executive President, on-site at NEPCON Tokyo 2026. With deep expertise in global technology ecosystems and supply chain innovation, Marcus will be leading live discussions on how agentic AI can solve the industry’s toughest operational challenges. 

Stop by our booth to: 

• Get a printed copy of the full Intelligence Report on Agentic AI 
• Speak with Marcus and our AI & supply chain experts 
• Discover how Fusion is integrating intelligent workflows into real-world electronics manufacturing 
• Explore pilot opportunities for AI-driven supply chain resilience 

Your Invitation: Secure VIP Access to NEPCON Tokyo 2026 

We’ve reserved complimentary VIP passes for our partners, clients, and industry peers who want front-row access to the future of intelligent manufacturing. 

Register for Your VIP Ticket Through Fusion Worldwide 
 

What is NEPCON? 

NEPCON Japan is Asia’s leading electronics technology exhibition, focusing on electronics R&D, manufacturing, and packaging technologies. It’s a major hub for professionals in semiconductors, automotive electronics, telecommunications, and advanced manufacturing. 

When and where is NEPCON 2026 taking place? 

• Dates: January 21–23, 2026 (Wednesday–Friday)  
• Time: 10:00 AM – 5:00 PM (JST)  
• Venue: Tokyo Big Sight, Ariake, Tokyo, Japan  
• Organizer: RX Japan Ltd. 

What is Fusion Worldwide’s role at NEPCON 2026? 

Fusion Worldwide will be exhibiting in Electronic Components & Materials Expo Hall, Booth E23 at NEPCON 2026. Fusion's team of experts will be available for one-on-one consultations to discuss how they can help businesses navigate supply chain challenges and find hard-to-source electronic components.